UV and green light can be used according to requirementsPCBCutting and splitting, can be applied to various types of beltsV-CUTStamp holePCBPrecision cutting and forming of circuit boards, as well as opening windows and covers, for the separation of packaged circuit boards and ordinary light boards.
The device supports automatic loading and unloading cutting, which can achieve full board material loading and unloading at once, and can also process single piece receiving actions.
Model Features
1.Adopting high-performance ultraviolet technology/Green laser, with a small focused spot and narrow incision;
2.The board splitting process is clean and dust-free, avoiding circuit failure caused by conductive waste;
3.Can complete the installation ofPCBDirectly divide the board into boards; Separate the board without contact or stress;
4.High precision two axis working platform with high precision and fast speed;
5.OptionalCCDAutomatic positioning and calibration;
6.The processing process is automatically controlled by computer software, and the software interface provides real-time feedback to understand the processing status in real time.
Applications
Suitable for all typesPCBSubstrate cutting, such as ceramic substrates, soft hard bonding platesFR4、PCB、FPCFingerprint recognition module, cover film, composite material, copper substrate, aluminum substrate, etc.
Technical Parameter
UVlaser device |
Green Laser |
|
wavelength |
355nm |
532nm |
rated power |
10-20W |
35/40/60W |
Positioning accuracy of linear motor worktable |
±2μm |
|
Repetitive accuracy of linear motor worktable |
±1μm |
|
machine range |
400mmX300mm(Customizable according to customer requirements) |
|
CCDAutomatic positioning accuracy |
±3μm |
|
Single work format |
40х40mm |
110x110mm |
Mirror repeatability accuracy |
±1μm |
|
Cutting size accuracy |
<30μm |
|
Cutting position accuracy |
<50μm |
|
Capable of handling file formats |
Standard Gerber files, DXF files, PLT files, etc |